| PART |
Description |
Maker |
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| EYP2BH145 EYP05BE115 EYP05BE101 EYP1BF145 EYP2BH11 |
Thermal Cutoffs (TCO)/ Thermal-links Small and Insulation Type High Reliability
|
Panasonic Semiconductor
|
| NF3004-WA30A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
| SE2002-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
| KD2004-DC70A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KF3002-GM50A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| 1LWP2300 5TH21000 5TH23000 |
THERMAL Pads For SC, SV and SO relays Low thermal resistance Easy to use
|
celduc-relais
|
